Plasma refers to the fourth condition of matter. Plasma is a partially or totally ionized gas, thus, that particular gas condition in which neutral molecules, positive ions and free electrons are all present at the same time. In this case, plasma means low energy content: higher or lower energy content defines a "cold" plasma compared to a "hot" one. In this "status" any gas, even the most inert, acquires an extraordinary reactivity and is able to modify the chemical-physical characteristics of a surface.
Cold plasma is used for pre-treatment and cleaning of a substrate at low pressure (vacuum). This condition allows reactions to take place in a temperature range of 20 to 30°C, while in conditions of atmospheric pressure these are possible only at temperatures of hundreds of degrees. In fact, despite the low temperature of the gas, the temperature of the electrons is very high (from 20 to 50.000 K) due to the length of the free run of the particles. This makes it possible to treat organic material (for example plastic material), which do not tolerate high thermic loads.
The plasma of a gas is distinguished by its strong reactivity in particular conditions of pressure and in the presence of very intense electric fields triggered for example by DC generators, RF, MF, MW.
The applied electric field must supply sufficient energy to the particles which permit a general ionization of the gas due to reciprocal collision. The gas flow dosage, the process pressure and the intensity of the electric field must balance the ionizing forces and the natural tendency of ionization decay.
The nature of a plasma varies according to the type of gas, or to the mixture of different gases, pressure of gas/gases, form of volume which confines the plasma itself and the type of electric field which supports and maintains the plasma.
The plasma of particular gases, among which oxygen is always present, allows oxidation to develop at a low temperature when it comes into contact with the surfaces to be treated, that is the formation of functional groups on the surfaces themselves which permit optimal conditions for total cleaning to be obtained. Plasma treatment is an ecologically clean and dry technology as it requires a low amount of consumption material, there are no solvents and does not require any disposal of by-products.
It is a treatment that allows the removal of surface material forming volatile products.
It can be used for the micro-cleaning of surfaces contaminated by organic compounds.
Changing the nature of the process gas and blending, makes it possible to achieve different surface characteristics.
- It removes organic contaminants or residue layers
- It improves surface tension, and therefore wettability of the surfaces, reducing the angle with regard to liquids at optimal values
- It sterilizes
- It cleans any surface (of any nature, geometry and dimension) and modifies its chemical and electrostatic characteristics.
All The plants designed and manufactured by Kolzer use plasma treatments in order to achieve surface chemical modifications prior to varnishing, gluing, bonding, coating and decoration.
Successful production concept #1200 machines sold worldwide
PECVD “Plasma polymerization”
PECVD is a transparent coating with a barrier effect.
The growth of thin films onto a surface can be efficiently done through chemical reactions in vapor phase (Chemical Vapor Deposition, CVD) of components containing the element to be deposited.
Changing the process parameters, the precursors and the shape of the reactor, the PECVD technique makes it possible to deposit numerous materials.
Plasma-grafting allows the modification of superficial chemical characteristics of polymers, within specific chemical groups.
Exposing natural and synthetic polymers to specific plasmas, makes it possible to obtain surfaces chemically different from the original ones.
The result is a new product, with the same mechanical and physical characteristics, but with different possibilities in interacting with surrounding matter.
This treatment is usually applied in order to improve adhesiveness and wettability properties of polymers allowing the transformation of a surface, from water-repellent to hydrophilic.
Vice versa the use of fluorine-based gases transform the surface in a Teflon-like material, therefore having remarkable characteristics of hydrophobicity and oil repellency.
- FILM FLEXIBILITY
- STRONG ADHESION TO THE SUBSTRATE
- SHOCK RESISTANCE
- GAS BARRIER
- CHEMICALLY INERT
- NON REACTIVE
- SCRATCH AND WEAR RESISTANT
- WATER REPELLENT
- FOOD SAFE
- NON STICK
- NO SEDIMENT BUILDUP
||ASTM B117/97||>1200h salt spray|
||ASTM D 4652 - ASTM G48||Excellent|
||ASTM D 4652||Excellent|
||ASTM G 53||It resists without yellowing
|Bending||ASTM D 522||180° ("T")|
|Adhesion||ASTM D 3359||Excellent|
|Hardness||ASTM E18-11||400 Vickers|
With PECVD technology you can achieve similar benefits on all surfaces, metals, alloys, polymer and plastics, wood, glass….
Research carried out by our technicians, the constant cooperation with our customers and the most important laboratories worldwide, have allowed us to tune dedicated processes for a wide range of fields of application, for example: characteristics of surface hardness with low wearing coefficient, grafting, anti-corrosion in acid and alkaline environments, water repellence, oil repellence, fireproofing, scratch-resistance, non-sticking, anti-printing and bio-compatibility, anti-stain effect and decrease of water vapor (anti-fog properties), etc.
The main equipment parts are as follows:
- process chamber
- vacuum pumping group
- power supply system and control of gas flow
- power supply system, control and generation of plasma
- PC and software control to ensure repeatibility of the process
- safety and self-diagnostic system
The process chamber contains the Plasma sources (stainless steel bars, aluminum or titanium) powered by radio-frequency, mid - frequency or direct current.
The chamber is internally lined with stainless steel protection shields.
It is equipped with portholes for visual checking of the process and it’s thoroughly tested with a helium mass spectrometer to guarantee its perfect sealing and air tightness overtime.
Kolzer was the first company developing and marketing solutions based on nano film deposition using Plasma technology.
KOLZER is a premier manufacturer of customer specific vacuum coating systems, all built with the finest components available on the world market. For over 70 years, Kolzer has built plant that redefine vacuum coating standards and capabilities from the iconic DGK36" to the supreme MK63". Over 70 years of know-how is found in our technology competence: the Vacuum Plasma PECVD process.
Why a KOLZER system?
- Over 1200 plants installed worldwide
- Quick cycle times
- High production capability with low energy consumption
- More up time due to ease of loading/unloading and low maintenance
- High productivity with only a single operator
- Windows operating system with 24/7 internet connection
- Steel process chambers, built to last
- Eco friendly
- Space saving design
- PVD option available on all plants
- 2 years component warranty and 12 years minimum guaranteed working life
- Complete global network of consulting, engineering and renowned after sales service
No other vacuum coating company offers innovation such as multiple hybrid technology, production flexibility and reduction of consumables. The consumer offerings are an infinite array of indestructible bonds using nanotechnology. Over 60 years of expertise, lowest cost of ownership and the quickest cycle times available, assure you of the highest industrial standards while keeping a focused eye on the balance sheet.
The KOLZER Horizontal range DGK machines offer space saving production for small and large items. The innovative Vertical range MK delivers high speed, large production runs with ease of loading on the two system doors. KOLZER machine can be designed with customer specific sizes and loading variables to simplify operation and maximize output.
KOLZER’S Machine engineering technology stands out as it adapts to individual client requirements, offering sector specific processes. KOLZER offers qualified engineering for complex production systems.
The range of supplies includes plant families, from the” Mini compact plant” for research companies and laboratories, to more elaborate coating systems and special plants for in-line processes, larger sized articles and hybrid systems.
Horizontal range DGK®
Space saving, practical and easy to use. Dual loading systems supplied with every machine, that offer a single operator speed, accuracy and high productivity at the touch of a button.
The classical work system combines single and multiple technologies in one system offering superior results and versatility. The complete range of plants in standard sizes:
DGK24” diameter 610 mm
DGK36” diameter 1000 mm
DGK48” diameter 1200 mm
DGK63” diameter 1600 mm
(*Custom sizes available)
Vertical range MK®
The KOLZER vertical MK range is a marvel of design innovation. From the dual direct loading and unloading doors to the easy to use Windows software, the entire production cycle is fast and carefree. These vertical systems offer multiple technologies in one system for flexibility and creativity all in one machine.
The standard family plant range:
MK34" diameter 1000 mm
MK63" diameter 1.600 mm
(* Custom sizes available)
Contact our headquarters, our technicians will be at your disposal for any information you may require